BGA rework station/BGA repair station
Three independent heater
With hot air and IR to preheat
For computer motherboard
BGA rework station/BGA repair station
Features
1.With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
2.Upper heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time;
3.Three temperature zone with independent PID to control heating process, more stable and accurate;
4.Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;
5. After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;
6.Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles;
7.Build-in vacuum pump, no need gas source.
Specifications
PCB size 
 ≤L540 *W450mm 
PCB Thickness 
 0.1~5mm
 Temperature Control
 K Thermocouple, Closed loop
 PCB Positioning
 Outer
 Sub (Bottom) heater
 Infrared 2400W
 Main (Top) heater
 Hot air 800W+800W
 Power supply
 Single phase 220V,50/60Hz,3.4KVA
 Machine dimension
 L700 ×W475×H520mm
 Weight of machine
 Approx.33kgs
 
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