BGA800 rework station

BGA800 rework station mainly be used in repairing BGA chips industry like desk computer,notebook PC,mobile phone,game box.

It is a multi-function and usage repairing system. BGACSPQFPPLCCSOP and others are applied for BGA800; Beside standard components, strip connector, electrical outlet , melt shield and other abnormity are repaired; surface components, through hole components like PGA are repaired, too.
Economical investment, we consider real production and cost during designing the machine. Accurate temperature, exact solder efficiency and better BGA position which reduce investment cost.

Technology parameters
input voltage
AC220V 50/60Hz 10A
total power
1100W
bottom heating power/ the highest temperature
600W/450
bottom preheating area
200*200MM
top heating power/the highest temperature
500W/400
temperature feedback
RTD sensor, closed loop controlling
max size of chips
70mm×70mm
min size of chips
5mm×5mm
max weight of chips
55g
max size of PCB
400mm×400mm
max thickness of PCB
3-6mm
Application
BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF,BCC
Dimension
400×350 ×410mm
Weight
About 10 KGS