SMT Infrared rework,soldering equipment,BGA repair,

BGA900 rework station deal with BGA, CSP, LGA, Micro SMD, MLF ,BCC assemble rework system for super dense foot chip.

function introduction
1Adopt best heating material to control disassemble and weld for BGA.
2Hot air and temperature can be adjusted, and generating high temperature rotate air.
3Moving heating head, easy operation.
4 There are two heating zone heat independently in the top and bottom. The first heating zone can control temperature, the second heating zone make PCB heat to get best welding effect.
5There are different temperature profiles in the top and bottom. Large power wind motor can cool rapidly to make PCB perfect.
6V trough to locate PCB, the max PCB is 450*400mm
7Adjusting PCB frame with anti-scald protection design
8Support frame in the BGA welding district, adjust support height to avoid going down of welding district.
920 segments warm-up controlling, it can save 2 groups setting temperature profiles.
10Adopt import high precision thermocouple to achieve inspect temperature minutely.
11With alarm and remind function after disassembly and weld. The circuit can cut off when short circuit. With super temperature protection function.
12With computer communication function, PC serial port inside, temperature interface outside, with software to achieve computer control.
13With different size hot air nozzle. It is easy to replace.
14Hand vacuum absorb pen to absorb BGA, the suction can be adjusted.
15With head lamp to increase ray in the working district.
16It is suitable for lead and lead free welding.
Parameters and specification
input voltage
AC220V 50/60Hz 10A
system power
2000W
pre-heating power in the bottom/highest temperature
1200W/350
Pre-heating area in the bottom
240*240MM
hot air power on the top/highest temperature
800W/450
temperature feedback
RTD sensor, close loop control
Flux in the hot air head
8,16,24 L/Minute can be chosen
Max chip size
70mm×70mm
Min chip size
1mm×1mm
Max chip weight
55g
Max PCB size
350mm×350mm
Max thickness of PCB
3mm
Suitable chip
BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF,BCC
Dimension
545×440 ×488mmL*W*H
Weight
About 25 KGS
Adjustment accuracy
0.025mm
Min foot space
0.3mm