Thursday, July 21, 2011

New! Full-Auto Solder and Desolder, Optical Alignment ,Hot Air+IR Mix Heating BGA Rework Station For All Kinds of Chipset

Optical Alignment System BGA Rework Station
1.Heat in mix IR+HOT AIR
2.Separate 3 heaters
3.Solder and unsolder automatically
New!
Full-Auto Solder and Desolder, Optical Alignment ,Hot Air+IR Mix Heating BGA Rework Station For All Kinds of Chipset
WDS-750 is a
small size

rework station that can repair big size PCB board in
630×630 mm
. Equipped with
optical alignment system
. Heat in mix heating way of
IR+ HOT AIR
.
Soldering and desoldering 2 in 1
, controlled by software.


Features:
l Hot air head and mounting head are designed 2 in 1. Solder and desolder automatically.
l Upper and lower heater take Hot air+ IR mix heating. Upper heater uses two-path and direct injection way. IR acts on the heating area directly in the meanwhile hot air works. They interact to heat quickly with temp. Remains even. ( heating-up speed is up to 10°C/S)
l Independent 3heaters, upper and lower heaters to be one move together, and the PCB can be moved along X, Y directions. Lower heaters can move up/ down and support PCB, controlled by motors automatically. With the PCB fixed on the clamp and no need move the PCB, the upper and lower heaters to be one move toward to the BGA.
l Original bottom preheating table that is made of Germany-imported good quality exothermic materials (plated IR tube) + constant temp. glass (resist heat up to 1800°C), preheating area is up to 500*420 mm.
l Preheating table, clamp device and cooling system can move integrally in X direction that facilitates and secures locating PCB and desoldering.
l Make the best of the equipment room. The relatively small equipment accomplished rework of oversized PCB. The max. Processed PCB size is up to 630*610 mm, no rework dead space.
l Built-in vacuum pump. Angel rotates in 60°. Fine-adjusting and mounting suction nozzle.
l The suction nozzle can detect the height of taking and mounting BGA. The pressure is controlled under 10g. it is suitable foe small size BGA with the function of zero pressure taking and mounting.
l Color optical vision system is with function of prism, biocolor, zoom in and fine-adjusting. Move toward X, Y directions manually. It can distinguish the color aberration and focus automatically. Software operation. Wireless remote control 27X optical zoom. The Max. BGA size 70*70 mm can be reworked.
l Built-in industrial computer, touch-screen interface. PLC control, real-time temp. Profile displays. Setting profile and actual measured profile can be displayed. The actual measured profile can be analyzed.
l 8 segments up (down) temp. + 8 segments constant temp. control, it can save a great deal of profiles that can be analyzed on the touch-screen.
l Many carious sizes alloy nozzles can be replaced easily and oriented by rotating in 360°
l Equipped with thermocouple ports. It can real-time monitor and analyzed the temp. of multiple points.
l Equipped with azotes access to protect soldering that secures the rework.

Optical functions:
It produces the long time temp. difference of 30°C between the heating area and around area to protect the small BGA around from melting. It is suitable for the glued BGAS of cell phone and notebook.
it can be upgraded to KID-R780 with the additional function of suction nozzle rotating in 360°. It is controlled by stepping motor with the rotating angles can be memorized.
it can be upgraded to KID-R780 with the additional function of suction nozzle rotating in 360° controlled by stepping motor with the rotating angles being memorized, optical alignment is controlled by remote control motor, the positions of taking BGA and alignment can be memorized. It will observe the four corners of BGAs automatically.
Technology parameter
Style NO.
WDS-750
Maximum PCB size
L630*W 610mm
PCB thickness
0.5~4 mm
Chips apply
1*1~70*70mm
Chip minimum space apply
0.15mm
Mounting maximum weight
500g
Mounting precision
±0.0 1mm
PCB locating way
Outer or location hole
Working station micro-adjust
Forward/backward ±15mm, left/right±15mm
Temperature controlling way
K-type thermocouple, closed loop control
Lower hot air heating
Hot air 800W
Upper hot air heating
Hot air 1200W
Bottom pre-heating
IR 6000W
Power applies
Three- phases: 380V, 50/60 Hz
Machine size
L970*W700*H830mm ( exclude frame)
Machine weight
About 130 KG





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