Friday, August 12, 2011

Laptop repair ZX-C2 bga rework machine,bga rework system

ZX-C2 bga rework machine,bga rework system
1.three independent heater
2.IR and hot air
3.Repair laptop,XBOX 360,PS3
ZX-C2 bga rework machine,bga rework system
Features:
1. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
2. Upper and bottom heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time;
3. Three heating zone with independent PID to control heating process, more stable and accurate.
4. Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;
5. After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;
6. Equipped with a variety size of hot-air nozzle, or made according to special requirements;
7. Build-in vacuum pump, no need gas source.


SPECIFICATION
PCB Size
≤L330×W320mm
PCB Thickness
0.1~5mm
Temperature Control
K Thermocouple, Closed loop
PCB Positioning
Outer
Sub (Bottom) heater
Infrared 2400W
Main (Top+bottom) heater
Hot air 800W+800W
Power supply
Single phase 220V,50/60Hz,4.0KVA
Machine dimension
L550×W530×H570mm
Weight of machine
Approx. 37kgs

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