Cost-effective ZX-D3 bga rework machine,bga rework system

ZX-D3 bga rework machine
1.Touch screen control
2.With camera to monitor solder ball melting
3.USB port to export profile
ZX-D3 bga rework machine,bga rework system
Features:
1. With PLC user interface control, display actual temperature of three zone and a test temperature curve, can export temperature profile;
2. When welding,with CCD camera to monitor the melting process of solder ball;
3. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
4. Three heater with 9 segment temperature up (down)+9 segment constant temperature control, can store 40 groups temperature curve;
5. Three heating zone with independent PID to control heating process, more stable and accurate;
6. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;
7. After removal and welding with cooling fan to cool PCB board, ensure welding effect;
8. Temperature profile parameter with password protection;
9. Equipped with a variety size of hot-air nozzle, or made according to special requirements;
10. Build-in vacuum pump, no need gas sources.


SPECIFICATION
PCB Size
≤L500×W300mm
PCB Thickness
0.1~5mm
Temperature Control
K thermocouple PID Closed loop
PCB Positioning mode
Outer
Bottom preheat
Infrared 2400W
Main (Top+bottom) heater
Hot air 800W+800W
Power supply
Single phase 220V,50/60Hz,4.0KVA
Dimension
L650×W700×H550mm
Weight
Approx. 50kgs