Manual Economical BGA Rework Station for Solder and Unsolder All Sealed Chips

Economical BGA rework station:
1.3 heaters
2.Mix bottom IR and hot air heating
3.Optical position system controlled by hand
Manual Economical BGA Rework Station for Solder and Unsolder All Sealed Chips
WDS-620 is an economical rework station to solder and unsolder all sealed chip, with optical system controlled by hand.
Feature
Hot air head and mounting head 2 in 1design, heating directly after mounting without moving PCB to avoid BGA being displacement, double speed-adjustable motor driving, manual hot air head move up and down.
Upper hot air head is with new style heating way with IR+ hot air mix heating. The temperature goes up in high speed to make big temperature difference between BGA to be unsoldered and around BGA that will not be affected, suit best for the electronics with small spaces between chips.
Upper and lower hot air and bottom IR heat separately, the heating time and temperature displayed on the touch screen.
Movable bottom pre-heats big area, PCB jig adjustable by X and Y axes, the maximum jig size reach 550*500mm.
Bottom power across flow fan cools down rapidly and safely.
Color optical vision system with prismatic, double colors and zoom in and micro-adjusting function, aberration distinguish setting included, auto- focus, software operation, 27X optical zoom, Max BGA size 70*70 mm and minimum 1.5*1.5 mm can be reworked.
Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve that can be analyzed.
Inbuilt vacuum pump, angle rotates in 60 °, precisely micro-adjustable mounting suck nozzle.
8 segments up (down) temp + 8 segments constant temperature control. Great memory capacity for temperature curves, analyze curves on the touch screen.
Nozzle can distinguish mounting height with pressure controllable with 10 grams.
Many sizes metal hot air muzzle. Easy to replace, locate in any angles.
Color optical vision system moved by head
Equipped with thermocouple port, real-time temperature monitoring and analyzing.
Technology parameter
Style NO.
WDS-620
Maximum PCB size
L550*W 500mm
PCB thickness
0.5~2.5 mm
Chips apply
1*1~70*70mm
Chip minimum space apply
0.15mm
Mounting maximum weight
500g
Mounting precision
±0.0 1mm
PCB locating way
Shape
Working station micro-adjust
Forward/backward ±15mm, left/right±15mm
Temperature controlling way
K-tape thermocouple, closed loop control
Lower hot air heating
Hot air 800W
Upper hot air heating
Hot air 1200W
Bottom pre-heating
IR 3600W
Power applies
Single phase: 220V, 50/60 Hz
Machine size
L850*W750*H630mm
Machine weight
Approx×80 KG

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